Haptic and Audio Interaction Design [electronic resource] : 8th International Workshop, HAID 2013, Daejeon, Korea, April 18-19, 2013, Revised Selected Papers / edited by Ian Oakley, Stephen Brewster.

Contributor(s): Oakley, Ian [editor.] | Brewster, Stephen [editor.] | SpringerLink (Online service)Material type: TextTextSeries: Lecture Notes in Computer Science ; 7989Publisher: Berlin, Heidelberg : Springer Berlin Heidelberg : Imprint: Springer, 2013Description: XII, 137 p. 46 illus. online resourceContent type: text Media type: computer Carrier type: online resourceISBN: 9783642410680Subject(s): Computer science | Multimedia systems | Education | Computer Science | User Interfaces and Human Computer Interaction | Information Systems Applications (incl. Internet) | Multimedia Information Systems | Computers and Society | Models and Principles | Computers and EducationAdditional physical formats: Printed edition:: No titleDDC classification: 005.437 | 4.019 LOC classification: QA76.9.U83QA76.9.H85Online resources: Click here to access online
Contents:
Non-intrusive and Thermal Haptics -- New Interfaces and Interactions -- Emotion and Affect -- Music.- Mobile Devices and Applications.
In: Springer eBooksSummary: This book constitutes the refereed proceedings of the 8th International Conference on Haptic and Audio Interaction Design, HAID 2013, held in Daejeon, Korea, in April 2013. The 14 full papers presented were carefully reviewed and selected from numerous submissions. The papers are organized in topical sections on non-intrusive and thermal haptics, new interfaces and interactions, emotion and affect, music, and mobile devices and applications.
Item type: E-BOOKS
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Non-intrusive and Thermal Haptics -- New Interfaces and Interactions -- Emotion and Affect -- Music.- Mobile Devices and Applications.

This book constitutes the refereed proceedings of the 8th International Conference on Haptic and Audio Interaction Design, HAID 2013, held in Daejeon, Korea, in April 2013. The 14 full papers presented were carefully reviewed and selected from numerous submissions. The papers are organized in topical sections on non-intrusive and thermal haptics, new interfaces and interactions, emotion and affect, music, and mobile devices and applications.

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